Due to the increase of integration and running speed in electronic equipments, along with the employment of high power chips, electronic packaging materials with better properties are claimed. As the second-generation electronic packaging materials, WCu/MoCu alloys are confronted with great challenges in the future development, even though their industrialization has been realized. On one hand, they are possible to continue their application in electronic packaging; one the other hand, they may be eliminated in the competition against other materials. Therefore, it is imperative to fully take advantage of each component in WCu/MoCu alloys based on the current technology, and to obtain electronic packaging materials with high thermal conductivity, low coefficient of thermal expansion and superior mechanical properties. In this paper, the performance index of electronic packaging materials are introduced, and the thermal properties and preparation techniques of WCu/MoCu alloys are reviewed. Moreover, prospects on the development trend of WCu/MoCu alloys are presented, aiming at the key property of high thermal conductivity.