[1]韓俊義,段慶文. 白光LED用紅色熒光粉的研究進(jìn)展[J].中國(guó)材料進(jìn)展,2011,(3):036-46.
HAN Junyi,DUAN Qingwen. Research Development of Red Emitting Phosphor for White Light LED[J].MATERIALS CHINA,2011,(3):036-46.
點(diǎn)擊復(fù)制
白光LED用紅色熒光粉的研究進(jìn)展(
)
中國(guó)材料進(jìn)展[ISSN:1674-3962/CN:61-1473/TG]
- 卷:
-
- 期數(shù):
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2011年第3期
- 頁(yè)碼:
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036-46
- 欄目:
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特約研究論文
- 出版日期:
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2011-03-25
文章信息/Info
- Title:
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Research Development of Red Emitting Phosphor for White Light LED
- 作者:
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韓俊義; 段慶文
-
(1. 洛陽(yáng)單晶硅有限責(zé)任公司,河南 洛陽(yáng) 471009)
(2. 西北有色金屬研究院,陜西 西安710016)
- Author(s):
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HAN Junyi; DUAN Qingwen
-
(1. Luoyang Single Crystal Silicon Co.Ltd.Luoyang 471009,China)
(2. Northwest Institute for Nonferrous Metal Research,Xi an 710016,China)
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- 關(guān)鍵詞:
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白光LED; 紅色熒光粉; 稀土
- 文獻(xiàn)標(biāo)志碼:
-
A
- 摘要:
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白光LED具有工作電壓低、功耗低、可靠性高、使用壽命長(zhǎng)、環(huán)境友好和高能效等一系列優(yōu)點(diǎn),是未來(lái)照明光源的發(fā)展方向。利用LED技術(shù)實(shí)現(xiàn)白光的方法主要有3種,其中采用藍(lán)光、紫光及近紫外LED芯片激發(fā)紅、綠、藍(lán)等三基色或多基色熒光粉得到白光LED的技術(shù)具有成本低、顯色性好等優(yōu)勢(shì),是白光LED的主要發(fā)展方向。紅色熒光粉在調(diào)制白光的色溫及改善其顯色性等方面起重要作用,其制備技術(shù)是目前制約白光LED大規(guī)模應(yīng)用的關(guān)鍵技術(shù),亟待解決。詳細(xì)介紹了白光LED用紅色熒光粉的十余個(gè)主要材料體系的發(fā)光性能、基本制備方法、取得的研發(fā)進(jìn)展,簡(jiǎn)單探討了其未來(lái)發(fā)展趨勢(shì)。
- Abstract:
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White light LED is a promising future lighting source,because it has many advantages including low voltage,low power consumption,high reliability,long service life,environment friendliness, and high energy efficiency,etc. Among the three major preparation methods,the one using blue,violet and near ultraviolet LED chip to excite the trichromatic phosphor or multichromatic phosphor based on red,green and blue phosphor is nowadays an acceptable solution,which possesses low cost and better chromogenic performance. However,red emitting phosphor,the key component in adjusting the color temperature and chromogenic performance in order to get high purity white light,is actually the bottleneck obstructing large scale application of white light LED. More than ten red emitting phosphor material systems for white light LED usage,their performances,preparation processes,and recent developments are introduced in detail, and the technology trends are briefly discussed.
更新日期/Last Update:
2011-04-01