[1]雷文,呂文中.低介微波介質陶瓷基板材料研究進展[J].中國材料進展,2012,(7):016-25.[doi:10.7502/j.issn.1674-3962.2012.07.03]
LEI Wen,LU Wenzhong.Investigating Progress on Low Permittivity Microwave Dielectric Ceramic Substrate[J].MATERIALS CHINA,2012,(7):016-25.[doi:10.7502/j.issn.1674-3962.2012.07.03]
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低介微波介質陶瓷基板材料研究進展(
)
中國材料進展[ISSN:1674-3962/CN:61-1473/TG]
- 卷:
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- 期數:
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2012年第7期
- 頁碼:
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016-25
- 欄目:
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特約研究論文
- 出版日期:
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2012-07-25
文章信息/Info
- Title:
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Investigating Progress on Low Permittivity Microwave Dielectric Ceramic Substrate
- 作者:
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雷文; 呂文中
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(華中科技大學,湖北 武漢 430074)
- Author(s):
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LEI Wen; LU Wenzhong
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(Huazhong University of Science and Technology, Wuhan 430074, China)
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- 關鍵詞:
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微波基板; 介質陶瓷; 低介電常數; 表面致密化
- DOI:
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10.7502/j.issn.1674-3962.2012.07.03
- 文獻標志碼:
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A
- 摘要:
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低介電常數能減小基板與電極之間的交互耦合損耗并提高電信號的傳輸速率,高品質因數有利于提高器件工作頻率的可選擇性和簡化散熱結構設計,近零的諧振頻率溫度系數有助于提高器件的頻率溫度穩定特性。特別在工作頻率逐漸提高的情況下,介電損耗不斷增大,器件發熱量迅速增加,材料的熱導率成為一個需要重點考慮的因素。由于陶瓷材料的熱導率是有機材料的20倍左右,因此,低介電常數微波介質陶瓷成為制備高性能基板的理想材料。此外,基板材料還需具備高強度和優越的表面/界面特性等綜合性能。鑒于此,首先評述了介電常數小于15的低介微波介質陶瓷材料體系的研究進展情況,在此基礎上,介紹了降低基板材料介電常數的方法和表面致密化措施,最后指出了在高性能低介微波介質陶瓷基板材料研制過程中面臨的問題及今后的發展方向。
- Abstract:
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Low permittivity (ε r) can minimize crosscoupling loss between substrate and conductor and shorten the time for the electronic signal transition, and high quality factor (Q·f) can increase selectivity and simplify heat dispersing structure, moreover near zero temperature coefficient of resonant frequency (τf) can ensure stability of the frequency against temperature change. Especially as working frequency gradually expands, thermal conductivity of substrate should be considered carefully due to an increase in dielectric loss and calorific value. Thermal conductivity of ceramics is about 20 times as that of organic materials, therefore, lowpermittivity microwave dielectric ceramics become promising materials for high performance substrate applications. In addition, high strength and excellent surface/interface characteristics are also required. So an overview on low permittivity microwave dielectric ceramics with εr <15 are present firstly, and then measures on reducing permittivity and increasing surface densification are introduced. Finally, some suggestions of investigating high performance lowpermittivity microwave dielectric ceramic substrates are also proposed.
更新日期/Last Update:
2012-08-02