[1]賈志宏,王雪麗,邢遠,等.基于FIB的三維表征分析技術及應用進展[J].中國材料進展,2013,(12):735-741.[doi:10.7502/j.issn.1674-3962.2013.12.04]
JIA Zhihong,WANG Xueli,XING Yuan,et al. FIB three-dimensional characterization analysis techniques and its application progress[J].MATERIALS CHINA,2013,(12):735-741.[doi:10.7502/j.issn.1674-3962.2013.12.04]
點擊復制
基于FIB的三維表征分析技術及應用進展(
)
中國材料進展[ISSN:1674-3962/CN:61-1473/TG]
- 卷:
-
- 期數:
-
2013年第12期
- 頁碼:
-
735-741
- 欄目:
-
特約研究論文
- 出版日期:
-
2013-12-31
文章信息/Info
- Title:
-
FIB three-dimensional characterization analysis techniques and its application progress
- 作者:
-
賈志宏; 王雪麗; 邢遠; 劉瑩瑩; 劉慶
-
(重慶大學材料科學與工程學院,重慶400044)
- Author(s):
-
JIA Zhihong; WANG Xueli; XING Yuan; LIU Yingying; LIU Qing
-
(College of Materials Science and Engineering,Chongqing University,Chongqing 400044,China)
-
- 關鍵詞:
-
FIB三維表征技術; 3D-SIMS; 3D-Imaging; 3D-EDX; 3D-EBSD
- DOI:
-
10.7502/j.issn.1674-3962.2013.12.04
- 文獻標志碼:
-
A
- 摘要:
-
聚焦離子束(Focused ion beam, FIB)技術憑借其獨特的微納尺度制造能力和優勢,已成為納米科技工作者不可或缺的工具之一。隨著新型FIB硬件設備的多功能化,FIB三維表征技術的不斷完善,使FIB三維表征技術在材料研究領域的應用更加廣泛和深入。與其他三維表征技術相比,FIB三維表征技術具有控制精度高、分析微觀區域大、分辨率高等特點。FIB技術與SIMS、SEM、EDX、EBSD等系統的結合,可對不同材料進行三維空間狀態下的形貌、成分、取向等信息的分析。本文簡要概述了3D-SIMS、3D-Imaging/EDX、3D-EBSD四種基于FIB的三維表征技術,具體包括FIB三維表征技術的成像-切割的原理及過程,綜述了幾種不同表征手段在各種材料中的應用和發展,最后指出了FIB三維表征技術在應用中的一些不足以及對該技術發展方向的展望。
- Abstract:
-
Focused ion beam(FIB) technology has become one of indispensable tool in nano technology area with its unique micro-Nano-scale manufacturing capability and advantages. With multi-functionalizing of the new type hardware and improving of the 3D characterization technology, the applications of FIB 3D characterization technology in the field of materials research became more extensive and in-depth. FIB 3D characterization technology has many distinctive features, compared to other 3D characterization technology, such as highly controllable accuracy, largely detectable region, high resolution and so on. FIB technology can analysis the morphology, composition, orientation of different materials in three-dimensional space conditions when it combined with SIMS, SEM, EDX or EBSD systems. This paper briefly summarized four different 3D characterization technologies include 3D-SIMS, 3D-Imaging/EDX and 3D-EBSD, and introduced the details of imaging-cutting principle and process of FIB 3D characterization technology. At the same time, this paper also summarized the applications and the development of several different characterization methods in different materials, and pointed out some deficiencies in application and prospects for the development direction of the FIB 3D characterization technology in the end.
備注/Memo
- 備注/Memo:
-
收稿日期:2013-08-31
基金項目:國家自然科學基金資助項目(51271209);中央高校基本科研業務費資助項目(CDJZR12130048)
通信作者:賈志宏,男,1974年生,教授,博士生導師
更新日期/Last Update:
2013-12-03