文章信息/Info

Title:

Thermal Resistance Analysis of Ceramic Embedded FR4 Heat Dissipation Substrate

文章編號:

1674-3962(2020)04-0332-05

作者:

秦典成; 陳愛兵

（樂健科技（珠海）有限公司，廣東 珠海 519180）

Author(s):

QIN Diancheng;  CHEN Aibing

(Rayben Technologies (Zhuhai) Ltd. Co., Zhuhai 519180, China)

關鍵詞:

嵌埋陶瓷; LED; 結溫; 熱阻

Keywords:

ceramic embedded;  LED;  junction temperature;  thermal resistance

分類號:

TN312+.8

DOI:

10.7502/j.issn.1674-3962.201803021

文獻標志碼:

A

摘要:

基于熱電分離式設計理念，首先將表面經金屬化處理且具備高導熱率的AlN陶瓷片局部嵌入導熱率較低的FR4材料中，利用壓合工藝將二者復合制備成用于LED散熱管理的嵌埋陶瓷基板；然后借助SMT工藝將LED燈珠與上述散熱基板組裝成LED模組；最后利用結溫測試儀以及恒溫控制系統對不同AlN尺寸及不同功率LED的上述模組進行了結溫測試，并依據結溫測試結果對上述嵌埋陶瓷基板的散熱能力進行了對比研究。結果表明，當LED功率一定時，隨著AlN陶瓷片尺寸不斷加大，嵌埋陶瓷的擴散熱阻及一維熱阻均隨之減小，從而致使基板總熱阻呈現出下降趨勢，LED的結溫也因此而隨之降低。而隨著LED功率不斷增加，嵌埋同一尺寸AlN陶瓷片的散熱基板因一維熱阻保持不變，擴散熱阻不斷增加，從而導致基板的總熱阻也不斷增加。

Abstract:

Based on the thermoelectric separation concept, metalized AlN ceramic blocks of high thermal conductivity were embedded into FR4 materials of relatively low thermal conductivity for the preparation of ceramic�瞖mbedded substrates for LED heat dissipation management employing lamination technologies. Secondly, LED lamps were mounted on the aforementioned substrates to form LED modules, the junction temperature of which were tested using junction temperature tester and temperature control table in terms of different AlN sizes and different LED powers. Additionally, the heat dissipation performances of the aforementioned substrates were studied on the base of junction temperature test results. The result showed that when the LED powers were constant, both the spread thermal resistances and one�瞕imensional thermal resistances of the ceramic�瞖mbedded substrates decreased as the AlN block sizes increased, thus led to decreased overall thermal resistances.