文章信息/Info

Title:

The Current State and Development Trend of WCu/MoCu Electronic Packaging Materials

作者:

王新剛; 張潤梅; 陳典典; 曾德軍; 許西慶; 袁戰偉

長安大學材料科學與工程學院

Author(s):

WANG Xingang; Zhang Runmei;  CHEN Diandian; ZENG Dejun; XU Xiqing; YUAN Zhanwei

School of Materials Science and Engineering, Chang’an University

關鍵詞:

WCu/MoCu合金; 電子封裝; 熱導率; 熱膨脹系數; 發展趨勢

Keywords:

WCu/MoCu alloys;  electronic packaging;  thermal conductivity;  coefficient of thermal expansion;  development trend

DOI:

10.7502/j.issn.1674-3962.2018.12.08

文獻標志碼:

A

摘要:

電子設備集成度和運行速度的不斷提高以及大功率芯片的使用，對電子封裝材料的性能提出了更高的要求。盡管已經實現產業化，WCu/MoCu合金作為第二代電子封裝材料，其未來發展正面臨極大的挑戰，既有可能持續應用于封裝領域，也有可能在與其它材料的競爭中被淘汰。在現有技術的基礎上，使WCu/MoCu復合材料充分融合各組元的優點，以獲得具有高熱導率、低熱膨脹系數以及良好力學性能的電子封裝材料，已成為迫在眉睫的工作。本文綜述了電子封裝材料的性能指標，以及WCu/MoCu合金的熱學性能與制備工藝, 并針對高熱導率這一關鍵性能對其發展趨勢進行了展望。

Abstract:

Due to the increase of integration and running speed in electronic equipments, along with the employment of high power chips, electronic packaging materials with better properties are claimed. As the second-generation electronic packaging materials, WCu/MoCu alloys are confronted with great challenges in the future development, even though their industrialization has been realized. On one hand, they are possible to continue their application in electronic packaging; one the other hand, they may be eliminated in the competition against other materials. Therefore, it is imperative to fully take advantage of each component in WCu/MoCu alloys based on the current technology, and to obtain electronic packaging materials with high thermal conductivity, low coefficient of thermal expansion and superior mechanical properties. In this paper, the performance index of electronic packaging materials are introduced, and the thermal properties and preparation techniques of WCu/MoCu alloys are reviewed. Moreover, prospects on the development trend of WCu/MoCu alloys are presented, aiming at the key property of high thermal conductivity.