文章信息/Info

Title:

Investigation on Thermal and Electrical Conductivity of 6.4 nm Gold Films Deposited on PEEK Substrate

文章編號:

1674-3962(2020)05-0379-06

作者:

林歡; 張建倫; 寇愛靜; 董華

（青島理工大學環境與市政工程學院，山東 青島 266033）

Author(s):

LIN Huan; ZHANG Jianlun; KOU Aijing; DONG Hua

(School of Environmental and Municipal Engineering, Qingdao University of Technology, Qingdao 266033, China)

關鍵詞:

PEEK基底; 金薄膜; 導電系數; 導熱系數; 洛倫茲數

Keywords:

PEEK substrate;  gold film;  electrical conductivity;  thermal conductivity;  Lorenz number

分類號:

TB383；O484

DOI:

10.7502/j.issn.1674-3962.201906021

文獻標志碼:

A

摘要:

運用高真空濺射鍍膜儀在聚醚醚酮（PEEK）薄膜和纖維表面分別制備了厚度為6.4 nm的金薄膜，并通過瞬態電熱技術（TET）測量了該金薄膜的導熱性和導電性。PEEK薄膜基底上厚度為6.4 nm的金薄膜的導熱系數、導電系數和洛倫茲數分別為283.97 W·m-1·K-1、2.46×107 Ω-1·m-1和3.49×10-8 W·Ω·K-2。PEEK纖維基底上厚度為6.4 nm的金薄膜的導熱系數、導電系數和洛倫茲數分別為81.11 W·m-1·K-1、1.20×107 Ω-1·m-1和2.17×10-8 W·Ω·K-2。研究發現，在不同基底材料上制備的金薄膜的導熱系數、導電系數和洛倫茲數均不同。這種差異可以歸因于以下兩點：一方面，不同基底材料上制備的金薄膜的晶粒尺寸不同；另一方面，不同的基底材料會引起基底與金薄膜結合界面的平整度不同。金薄膜晶粒尺寸越小，其電子的導熱系數、導電系數越小；金薄膜與基底的結合界面平整度越差，其聲子的導熱系數越小。

Abstract:

The gold films (the average thickness is 6.4 nm) coated on the surface of poly (ether-ether-ketone) (PEEK) film and PEEK fiber by the magnetron sputtering system were prepared. Transient electrothermal technique (TET) was used to acquire thermal and electrical conductivitiy of the gold films. The thermal conductivity, electrical conductivity and the Lorenz number of the gold film coated on PEEK film is 283.97 W·m-1·K-1, 2.46×107 Ω-1·m-1 and 3.49×10-8 W·Ω·K-2, respectively. The thermal conductivity, electrical conductivity and the Lorenz number of the gold film coated on PEEK fiber is 81.11 W·m-1·K-1, 1.20×107 Ω-1·m-1 and 2.17×10-8 W·Ω·K-2, respectively. It can be seen that the thermal conductivity, electrical conductivity and Lorenz number of the gold films coated on the different substrate materials are different. The difference is attributed to the facts that the different substrate materials can affect the grain size of the gold film and the flatness of the interface between the substrate and the gold film. The smaller the grain size is, the smaller the electron conductivity and thermal conductivity is. The worse the interface roughness is, the smaller the phonon thermal conductivity is.