文章信息/Info

Title:

Three�睤imensional Characterization Techniques of Dislocations

文章編號:

1674-3962(2021)06-0417-10

作者:

符銳1; 馮宗強1; 2; 3; 黃曉旭1; 2; 3

（1.重慶大學材料科學與工程學院，重慶 400044）（2.重慶大學 電子顯微鏡中心，重慶 400044） (3. 重慶大學 輕合金材料教育部國際合作聯合實驗室，重慶 400044）

Author(s):

FU Rui1;  FENG Zongqiang1; 2; 3;  HUANG Xiaoxu1; 2; 3

(1. College of Materials Science and Engineering, Chongqing University, Chongqing 400044, China) (2. Electron Microscopy Center, Chongqing University, Chongqing 400044, China) (3. International Joint Laboratory for Light Alloys (MOE), Chongqing University, Chongqing 400044, China)

關鍵詞:

位錯; 三維表征; 同步輻射X射線; 電子通道襯度成像; 透射電子顯微鏡; 體視學成像; 三維位錯晶體學

Keywords:

dislocation;  3D characterization;  synchrotron radiation X�瞨ay;  electron channeling contrast imaging;  TEM;  stereology imaging;  tomographic crystallography of dislocations

分類號:

TG113；TG115.21+3

DOI:

10.7502/j.issn.1674-3962.202103019

文獻標志碼:

A

摘要:

位錯的三維表征是準確認識位錯特性和行為的基礎。綜述了基于同步輻射X射線、聚焦離子束�搽娮油ǖ酪r度成像系統和透射電子顯微鏡的位錯三維重構方法，重點介紹了基于透射電子顯微鏡的原子分辨率位錯三維重構、體視學原理位錯三維重構和系列傾轉位錯三維重構方法的技術原理和應用實例，對比討論了上述技術在分辨率、定量表征和參量信息耦合能力方面的優缺點，隨后介紹了一種基于透射電子顯微鏡、可以實現位錯幾何和晶體學特征參量高精度耦合表征的位錯三維定量集成表征技術，并在此基礎上總結和展望了未來各類位錯三維表征技術的發展趨勢和技術特點。

Abstract:

The three-dimensional (3D) characterization of dislocations is the basis for full understanding the characteristics and behaviors of dislocations. In this article, the 3D dislocation characterization techniques based on the synchrotron radiation X-ray, the focused ion beam-electron channeling contrast imaging system and the transmission electron microscopy (TEM) are reviewed, with the emphases on the TEM-based methods such as atomic resolution, stereo pair and tilt-series reconstruction of dislocations. The spatial resolution, capability of quantification and coupling of parameters in all these methods are compared and discussed. A novel TEM-based tomographic crystallography method which can simultaneously, quantitatively and precisely characterize the geometric and crystallographic parameters of 3D dislocation structures is also introduced. Further, the technical trends and characteristics of the 3D dislocation characterization techniques in the future are foreseen and summarized.