文章信息/Info

Title:

The Influence of Surface State of Pure Ti on the Nucleation Mechanism of Electrolytic Copper Foil

文章編號:

1674-3962(2024)12-1111-07

作者:

戎萬; 楊斌; 馮慶; 王軼; 賈波; 張樂; 操齊高

1. 西北有色金屬研究院，陜西 西安 710016 2. 河南科技大學材料科學與工程學院，河南 洛陽 471023 3. 西安泰金新能科技股份有限公司，陜西 西安 710021

Author(s):

RONG Wan;  YANG Bin;  FENG Qing;  WANG Yi;  JIA Bo;  ZHANG Le;  CAO Qigao

1.Northwest Institute for Nonferrous Metal Research, Xi’an 710016, China; 2.School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, China; 3.Xi’an Taijin Xinneng Technology Co., Ltd., Xi’an 710021, China

關鍵詞:

鈦陰極輥; 電解銅箔; 晶粒度; 粗糙度; 初始沉積層

Keywords:

Ti cathode roller;  electrolytic copper foil;  grain size grade;  roughness;  initial deposition layer

分類號:

TQ153.1+4

DOI:

10.7502/j.issn.1674-3962.202405005

文獻標志碼:

A

摘要:

針對鈦陰極輥表面電沉積銅箔的高質量要求，主要開展純鈦片晶粒度和表面狀態對電解銅箔初始沉積層形核和生長影響規律的研究。形貌和成分分析結果表明，較高的晶粒度更有利于銅核快速形成，銅核優先在缺陷處形成，并逐漸長大連接成片；較大的粗糙度可使銅核快速長大，而隨著粗糙度的減小，銅核會在更多的位置形成，但長大后的尺寸減小。電化學分析結果表明，適當粗糙度的鈦片具有更高的耐蝕性和電荷轉移能力。此外，COMSOL建模結果證明鈦片表面的尖端位置具有較高的電流密度與較大的銅箔沉積厚度，電流密度和沉積厚度隨著距離鈦片表面的尖端位置越遠而變得更小。通過研究銅箔初始沉積層的形核和生長機制，可以為鈦陰極輥的制備提供理論指導，即增大鈦陰極輥的晶粒度、適當減小表面粗糙度和避免尖端區域的形成對于制備厚度均勻、表面平整的電解銅箔至關重要。

Abstract:

In response to the high-quality requirements for electrodepositing copper foil on the surface of titanium cathode roller, this article mainly conducts research on the influence of grain size and surface state of pure Ti on the nucleation and growth of the initial deposition layer of electrolytic copper foil.Characterization results of morphology and composition indicate that a higher grain size grade is more conducive to the rapid formation of copper nuclei, which preferentially form at the defect site and gradually grow and connect into pieces; a larger roughness can cause copper nuclei to grow rapidly, and as the roughness decreases, copper nuclei will form at more positions, but their size decreases as roughness grow. Electrochemical analysis results indicate that the Ti sheets with appropriate roughness have higher corrosion resistance and charge transfer ability. In addition, the results of COMSOL modeling demonstrate that the tip position on the surface of Ti sheets has a higher current density and a larger copper foil deposition thickness, and the current density and deposition thickness become smaller as the distance from the tip position on the surface of Ti sheets increases. This article provides theoretical guidance for the preparation of titanium cathode roller by studying the nucleation and growth mechanism of the initial deposition layer of copper foil. Increasing the grain size grade of titanium cathode roller, appropriately reducing surface roughness, and avoiding the formation of tip region are crucial for the preparation of electrolytic copper foils with uniform thickness and smooth surface.